Baking from 24hrs change to 16hrs Reliability plan

Brian

各位前輩先進好~
如果有Module(長29.5mm*寬22.0mm) Baking要從24hrs變更到16hrs,可靠度實驗要如何設計?要怎麼做?
Module相關的資訊如下:
1.The MSL of module is level 4 (Reference Document : IPC-JEDEC J-STD-033).
2.The baking temperature is 125ºC for 24hours or 60ºC for 13 days.
3.The allowable time period, after removal from a moisture barrier bag and before the solder reflows process, for a moisture-sensitive device to be exposed to a factory ambient not exceeding 30°C and 60% RH.
4.After the PCB is baked, it will be expired after 72 hours. Do the SMT process within 48 hours after baking is the best condition.
以上懇請多多指教~Thanks a lot.