請問 IC 構裝(封裝)產品的 pre-condition 用意

htnvt241

大家好~請教一下, 在 IC 封裝廠在進行 RA test 時, 常會講到要先做 pre-con.
請問,
(1)為什麼要先做 pre-con.? 它的作用是什麼 ?
(2)Pre-con. 有哪些項目? 可以在哪份國際規範裡找到?

謝謝~

temp30

國際規範是可參閱 JESD22-A113F ，此項著重將零件執行 reflow ，在可靠度測試前模擬執行系統製程組裝過爐，先確認在執行測試前不會因為過爐而影響後續的測試結果，當然如果過爐就有發現問題，後續的相關測試也就不需要在執行囉。

liaojenyi

Andrew E. Perkins - Suresh K. Sitaraman
"Solder Joint Reliability Prediction for Multiple Environments"
ISBN 978-0-387-79393-1
P.161
CAE的模擬也是應該把REFLOW條件加入，以便計算銲點疲勞壽命

htnvt241

了解, 感謝樓上兩位先進 !

賴威豪

Pre-condition 是模擬產品 運送過程+ 客戶SMT上板的條件
其中 TCT 5 cycles 是模擬空運的環境.
這樣的說法正確嗎?

hlperng

賴威豪 發表於 2014-1-14 08:59
Pre-condition 是模擬產品 運送過程+ 客戶SMT上板的條件
其中 TCT 5 cycles 是模擬空運的環境.
這樣的說法 ...

JESD 47I:2012, Stress-Test-Driven Qualification of Integrated Circuits
濕度敏感度水準前處理(MSL Preconditioning) (PC)，JESD22-A113，是 JESD47 第 5.6 節＜非密封封裝鑑定試驗要求＞(Nonhermetic package qualification test requirements)，「表2：非密封封裝元件鑑定試驗」(Qualification tests for components in nonhermetic packages)的第1道應力。
Conditions:
G) PC (Pre-conditioning) ensures that a device will be able to withstand multiple assembly cycles, and to simulate the stress from Printed Circuit Board assembly that a device in a field operation would receive prior to acceleration stress testing.  

JESD22-A113F:2008Forward
This document provides an industry standard test method for preconditioning components that is representative of a typical industry multiple solder reflow operation.

Introduction
The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated temperatures during board assembly, which combined with moisture in the package can induce internal package damage that could be a reliability concern.  Preconditioning of SMD packages is used to simulate the effects of board assembly on moisturized packages, prior to reliability testing.  This allows reliability testing at the component level on as shippable products with a board assembly simulation.  During preconditioning, test samples are subjected to temperature cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and electrical test before reliability testing.  

3.6 Temperature Cycle ChamberTemperature Cycle Chamber capabel of operating, as a minimum, over the range of (-40 +0/-10) °C to (+60 °C +10/-0) °C per JESD22-A104.  This equipment is only required if optional Step 4.3 is used.  

4.3 Temperature cycling Perform five (5) cycles of temperature cycle from -40 °C (or lower) to 60 °C (or higher) to simulate shipping conditions.  Acceptable alternative test conditions and temperature tolerances are A through I and L through N as defined in Table 1 of JESD22-A104, Temperature Cycling.  This step is operational based on product requirements.  

溫度循環試驗是模擬產品的運送條件，查證產品的運送性要求(Shippability Requirement)，但沒有證據說明此項試驗係模擬空運環境。

賴威豪

感謝版主的指教.
這樣來說 TCT 5 cyc 是生產廠商基本符合項目
隨不同客戶地區及運送條件, 這個項目必須做調整.
例如 海運三個月....

hlperng

賴威豪 發表於 2014-2-10 16:45
感謝版主的指教.
這樣來說 TCT 5 cyc 是生產廠商基本符合項目
隨不同客戶地區及運送條件, 這個項目必須做調 ...

JEDEC 建議溫度循環作 5 個循環模擬運送條件。實際上要做幾個循環是供需雙方協議確定。
Shipping 在一般試驗規範中是泛指運送意思，另一個常用的字為 transportation，shipping 不一定是限定海運。

nathanc

hlperng 發表於 2014-2-10 17:33
JEDEC 建議溫度循環作 5 個循環模擬運送條件。實際上要做幾個循環是供需雙方協議確定。
Shipping 在一般 ...

版主您好!

5個TCT為模擬運送, 一般情況下定義-40~60C.
For IC package, such as flip chip or BGA solder joints, and 光器件耦合(optics coupling)
請教設定Typical Cycles/Hr, Ramp rate, Soak time, Soak mode建議是多少?
Thanks

Nathan

Kaka

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