QKC20180323：陳文魁_設備品管智能化與工業 4.0

hlperng

品質學會品質知識社群 (QKC) 研討會
專題：設備品管智能化與工業 4.0
時間：2018 年 03 月 23 日(星期五) 19:00 - 21:00   
地點：品質學會九樓教室（台北市羅斯福路 2 段 75 號）
主講：陳文魁 會友

hlperng

ISO 28593:2017
6 Credit principle
The unifying concept behind the sampling schemes in this International Standard is the credit principle. It is assumed that a supplier submits for inspection a continuing sequence of lots of items. Each lot may be of any size.

NOTE. For short series of lots or for an isolated lot, the AOQL protection is still valid, in the sense that the expected outgoing quality will still be no worse than the AOQL. However, the realized average outgoing quality may well be worse than the AOQL, although the chance of this happening decreases as the series gets longer. Moreover, the supplier does not benefit to the same extent from an accumulation of credit and the resulting reduction in inspection costs.

At the start of inspection, the credit is set to zero. The appropriate sample size for each lot is determined from a formula involving the AOQL, the lot size and the credit. A random sample of this size is selected and inspected. If the first lot fails to meet the acceptance criterion, the credit remains at zero. Otherwise, the credit is increased by the lot size. The process is repeated with successive lots, with credit increasing by the size of accepted lots until a lot is non-accepted, at which point the credit is reset to zero and a new sequence is started.

By this means, a supplier who submits lots of consistently high quality is rewarded by smaller sample sizes and therefore lower inspection costs, while the required AOQL is still guaranteed.

Where items are supplied by a number of suppliers, this International Standard shall be applied to the lots from each supplier separately. Suppliers shall therefore have their own individual credit records.

hlperng

工業 4.0 人能做甚麼？抽樣計畫、產品檢驗、維護保養。今天著重在抽樣計畫，三個 excel 檔案分享。

MQAI (machine quality for artificial intelligence)
演講台灣品界推廣。
自動推進。
16949 制度面，MSA & SPC 比較熟悉
傳產 DFM/A，GD&T 公差分析，WCA 用加的。
顯著問題，車架之外，功能件都做。碳纖維車架 FMEA，CSG。機構件、機械件估差配當。
緊配，
DG&T 圓形半徑是甚麼分布？
performance function & limit state equation
drawing 是 engineering order，CNC 加工。
機械品質設計，
機台定期保養、計畫保養。
excel 檔案 MIL-STD-1916 = ISO 21247:2005 (revised by ISO 28594:2017)
ISO 18414:2006, Acceptance sampling procedures by attributes - Accept-zero sampling system based on credit principles for controlling outgoing quality

ISO 21247:2005, Combined accept-zero sampling systems and process control procedures for product acceptance (revised by ISO 28594:2017)

信用原則 (累積允收樣本數)

AQL (acceptance quality level)  = AQL (acceptable quality limit)
RQL (reject quality level) = LQ (limiting quality)

FMEA-MSRMFMEA:

ISO 28593:2017, Acceptance sampling procedures by attribures - Accept-zero sampling system based on creidit principle for controlling  (replace ISO 21247:2005)

ISO 28594:2017, Combined accept-zero sampling systems and process control procedures for product acceptance (replace ISO 18414:2006)
字碼、樣本大小、excel 可以自動查詢、不難。困難點在於如何推進。
AQL 精神，轉換準則，
Log book 紀錄簿，自動查字碼，決定樣本大小。計數型
計量型 F = S²/σ²

馬可夫鏈 (矩陣)

工業 4.0 靠設備，機台設備維護保養，
工業 4.0 品管人的角色？

人不再作執行業務，改做決策業務。

封測機台，晶圓切割成晶粒（晶片）
chip-out 裂痕產生，如何克服。
打線封裝，ESD 電性測試。Open short OK，銲腳。
自動化機台，切九刀、第十刀減慢速度，影像檢驗。慢刀、機台休息。

申請戴明獎，
一人多機 (23) 作業，打線機 (wire bonder)
批的定義，lead frame (2048 為一批)
99.7 %測試良率，晶圓良率，兩者不一定對等。
88 % ~ 92 % 良率差值。
MSA 電性測試，運用統計手法，100 項測試，400 萬片 平均數與變異數，
500 萬程式價值。自動化主導，有配合廠商。

LP (lean production), VSM (value stream mapping), RAMS, OEE & CMD

2018-04-13, 討論 ISO 26262 and 報告 OEE VSM, P-F Curve & CMD

2018-04-27, 討論 JEDEC FIT and 報告 RAMS (RCM)

FMEDA (ISO 26262 - IEC 61508)
FMEA-MSR (MIL-STD-1629 part 3)


MFMEA:

熱的問題。

被動元件 1000 萬/天，自動化
JEDEC
三個月壞，溫、濕度效應，環境效應

on-line sensor,
drift & peak monitoring

ct percent, A, B, C 及
AGP & LGP

資料交換，

設備運轉不發生故障，CMD, rms 轉速

五月:
環境效應: CMD 量測，適環性耐久性
壽命分析，品質分析（望大、望小特性圖解分析法 - 常態、韋伯、極值機率圖，圖紙與 excel 程式）
智能化:

CNC 加工，
ISO 230 精度分析

非常態分配:
Cpk = 11.xx
仁寶昆山廠

hlperng

可靠度為中心維護 (reliability-centered maintenance, RCM)
潛在失效 - 功能失效曲線 (P-F Curve)
時間分為三個階段：前攝區 (proactive)、預測區 (predictive)、反應區 (reactive)