IPC/JEDEC 9703:2009, 銲點可靠度機械衝擊試驗指南
本帖最後由 hlperng 於 2014-11-18 13:16 編輯IPC/JEDEC 9703:2009 Mechanical Shock Test Guidelines for Solder Joint Reliability
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Table of Contents
1. Scope
2. Applicable Documents
3. Terms and Definitions
4. Use Conditions (UC) Overview
4.1 Scope and Application of UCs
4.2 Capturing UC Data
4.3 Methods for Developing UCs
5. System Tests
5.1 Shock Test Equipment
5.1.1 Drop Testers
5.1.2 Shock Machines
5.1.3 Inclined Impact
5.1.4 Fixturing
5.2 Correlation Criteria
5.3 Test Recommendations
5.3.1 Testing Sample Recommendations
5.4 Test Flow
5.5 Post Test Analysis
5.6 Testing Output and Report Recommendations
6. System Board Level Testing
6.1 Board Testing Background
6.2 System Board Testing Recommendations
6.3 Correlation Criteria and Validity of Test Setup
6.4 Equipment Recommendations
6.5 Test Flows
6.6 Failure Analysis
6.7 Reporting Recommendations
7. Component Mechanical Shock Assessment
7.1 Component Assessment - General Considerations
7.2 Component Board Testing Recommendations
7.3 Correlation Criteria and Validity of Test Setup
7.4 Equipmnet Recommendations
7.5 Testing Flows
7.6 Failure Analysis
7.7 Reporting Recommendations
8. Metrics for Matching Test
8.1.1 Acceleration Based Method
8.1.2 Board Strain Based Method
Annex A: Sample Data Reporting Format
Annex B: Metrologies
Annex C: Shock Failure Analysis of Electronic Components
Annex D: Suggestions for Selecting Sample Size
Annex E: Suggestions for Finite Element Analysis in Mechanical Shock
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