壽命評估軟體 一問,
本帖最後由 Astro_tsai 於 2012-6-20 19:25 編輯最近看到一個軟體 Sherlock, 利用這軟體可以評估相關的壽命
以下是他的介紹, 看他後面的範例, 只要找出λ, 套入F(x)=1-R(x), R 套指數分布,
我很好奇如何在vib/temperature cycle 下去評估?
The Sherlock automated design analysis software is capable of providing a comprehensive assessment
of early stage circuit card design and its ability to meet quality, reliability, and durability expectations.
This assessment consists of a number of validated techniques, including physics-of-failure (PoF) based
prediction that takes into consideration the use environment and the required lifetime. PoF modeling is a
science-based approach that analyzes the loads and stresses in an application and evaluates the ability
of materials to endure them from a strength and mechanics of material point of view. The wearout
lifetime prediction will include a level of detail that provides the ability to understand the contributing
factors and make targeted improvements.
The analyzes that this software is capable of performing include:
1. Plated through hole (PTH) lifetime
2. Risk of conductive anodic filament (CAF) formation
3. Solder joint lifetime under thermal cycling
4. Solder joint lifetime under vibration
5. Risk of interconnect failure during mechanical shock
6. Mean time between failure (MTBF) calculation
振動的壽命評估應該是疲勞(fatigue)吧，用的是Steinberg書上的方法。 本帖最後由 liaojenyi 於 2012-6-25 21:21 編輯
Steinberg Formula 是比較保守的
Wild TN. Some fatigue properties of solder joints, IBM no. 73Z000421, Jan, 1973.
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